The world’s first single-crystal diamond wafer -- and also the largest-sized diamond that ever existed on Earth.

Employing a technology of mind-boggling complexity called diamond heteroepitaxy which creates single-crystal diamond on scalable substrates and combining it with other technologies, the company arrived at the first ever wafer that is a single crystal of diamond. Diamond Foundry Inc. claims that their single-crystal diamond wafers are the ultimate new tech component to solve the thermal challenges limiting AI & cloud computing chips, the power electronics of electric cars, and wireless communication chips.

Ultimate Thermal Conductor: No other material conducts heat as efficiently as single-crystal diamond, enabling chips to run faster and last longer.

Extreme Electrical Insulator: The thinnest slice of diamond insulates against very high voltages, enabling the next level of miniaturization in power electronics.

To achieve the ultimate thermal chip package, Diamond Foundry Inc. is bonding diamond atomically to integrated circuit (IC) wafers thinned at Angstrom precision. Thereby accelerating today’s most mega-tech industries by putting a diamond behind every chip. The culmination of the above will make AI and Cloud computing 3x Faster, Power Electronics 6x Smaller and Wireless communication 3x Farther.